发明名称 LSI electronic circuit support assembly
摘要 The assembly of electronic devices comprises a band support box (1) supporting an LSI circuit, and having holes (8) passing through the band. These holes are arranged two dimensionally in a film and are electrically connected to the LSI circuit by a cabling design. An insulating substrate (3) having input and output terminals is connected to chips (9) provided on the mounting substrate (6). These extend into, and make contact with the holes (8).
申请公布号 FR2747510(A1) 申请公布日期 1997.10.17
申请号 FR19970004616 申请日期 1997.04.15
申请人 NEC CORPORATION 发明人 SUYAMA TAKAYUKI;MIYOSHI TADAYOSHI
分类号 H01L21/60;H01L23/12;H01L23/498;H01L25/065;H05K3/34;H05K7/10 主分类号 H01L21/60
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