发明名称 |
APPLYING ENCAPSULATING MATERIAL TO SUBSTRATES |
摘要 |
Providing encapsulated electronic components on a circuit board by providing dams on a circuit board around areas on which respective electronic components will be mounted, mounting the respective electronic components within the dams on the circuit board, and printing encapsulating material through a stencil in order to provide deposits of encapsulating material over the electronic components and within the dams. |
申请公布号 |
WO9733304(A3) |
申请公布日期 |
1997.10.16 |
申请号 |
WO1997US02906 |
申请日期 |
1997.02.21 |
申请人 |
MPM CORPORATION |
发明人 |
GODIN, RICHARD;CORBETT, STEVEN, JAMES;GILLEO, KENNETH, BURTON;JOHNSON, ALDEN |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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