发明名称 APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE
摘要 <p>The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).</p>
申请公布号 WO1997038565(A1) 申请公布日期 1997.10.16
申请号 US1997001191 申请日期 1997.01.24
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