| 发明名称 |
APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE |
| 摘要 |
The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28). |
| 申请公布号 |
WO9738274(A1) |
申请公布日期 |
1997.10.16 |
| 申请号 |
WO1997US01187 |
申请日期 |
1997.01.24 |
| 申请人 |
MOTOROLA INC. |
发明人 |
BALLARD, GERALD, W.;TUROCY, JAMES, W.;BEISE, THOMAS, R. |
| 分类号 |
F25D1/02;F25D7/00;H01L23/473;H05K7/20;(IPC1-7):F25D23/12 |
主分类号 |
F25D1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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