发明名称 Stripline conductive track arrangement for monolithic integrated circuit
摘要 The arrangement includes a conductive track plane on a surface of a flat substrate with a conductive track structure. The structure contains contact elements with a conductive face in the conductive track plane and a protrusion of ductile metal, overlapping another conductive track of the plane. The protrusion is spaced from the other conductive track vertically to the plane, making contact with it by deformation. One conductive face (F) is insulated with respect to the other conductive track. Preferably the contact elements are arranged as an extension of a circuit component, forming the other conductive track by its conductive length.
申请公布号 DE19614111(A1) 申请公布日期 1997.10.16
申请号 DE19961014111 申请日期 1996.04.10
申请人 DAIMLER-BENZ AKTIENGESELLSCHAFT, 70567 STUTTGART, DE 发明人 WENGER, JOSEF, DR., 89250 SENDEN, DE
分类号 H01L21/768;H01P3/08;H05K1/00;H05K1/02;(IPC1-7):H05K3/22 主分类号 H01L21/768
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