发明名称 APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE
摘要 <p>The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28).</p>
申请公布号 WO1997038274(A1) 申请公布日期 1997.10.16
申请号 US1997001187 申请日期 1997.01.24
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