发明名称 |
APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE |
摘要 |
The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).
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申请公布号 |
WO9738565(A1) |
申请公布日期 |
1997.10.16 |
申请号 |
WO1997US01191 |
申请日期 |
1997.01.24 |
申请人 |
MOTOROLA INC. |
发明人 |
MCDUNN, KEVIN, J.;LIMPER-BRENNER, LINDA;PRESS, MINOO, D. |
分类号 |
H05K5/00;F25D1/02;F25D7/00;F28F13/02;H05K7/20;(IPC1-7):H05K5/00;F28D15/00;F25D23/12 |
主分类号 |
H05K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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