| 摘要 |
<p>A method of removing solder (60) from an area grid array pad (52) by applying a wire mesh (14) to a conductive surface (54) of the area grid array (52) that is covered with solder (60). Heat is applied to the wire mesh (14) and the conductive surface (54) of the area grid array (52) so that the solder (60) flows from the conductive surface (54) onto the wire mesh (14). The wire mesh (14) is removed from the conductive surface (54) thereby removing all solder (60) from the conductive surface (54) of the area grid array (52).</p> |
