| 摘要 |
<p>PURPOSE:To control a depth of a dicing groove at a desired depth, by a method wherein the depth of the groove obtained by cutting deeply into a part of an expanding tape to which a semiconductor wafer is not stuck is monitored and when the depth of the groove does not fall within a fixed range, cutting-in of the dicing groove is suspended. CONSTITUTION:A blade 5 begins to cut a groove from a part of an expanding tape 1 to which a wafer 2 is not stuck, moved parallel to the groove, a dicing groove 3 is cut deeply into the wafer and expanding tape 1 and cutting-in of the one dicing groove 3 is finished by cutting up to a part to which the wafer 2 is not stuck. A control part instructs a measuring device to measure a depth of the groove 3. The depth of the groove of the part to which the wafer 2 is not stuck is measured, in measurement of the depth of the groove 3. The measuring device scanns a feeler 6 in the direction meeting at right angles with an extending direction of the groove as it applies little pressing force to the feeler 6, the depth of the groove is measured by a vertical movement of the feeler 6 and a result is applied to the control part. In the case where the depth of the groove falls within a fixed range, cutting-in is kept on and in the case where the same does not fall within the fixed range, the cutting-in is suspended. When a height of the blade 5 is controlled, the cutting-in of the groove 3 is performed again automatically.</p> |
