| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of lead cutting in a semiconductor device capable of definitely covering a cutting plane of an outer lead with a solder layer and its device. SOLUTION: This method of lead cutting comprises a process of cutting an outer lead 2 protruded from a package 1 sealing a semiconductor chip with a resin to a predetermined length and a process of forming the outer lead 2 into a gull wing-shaped lead. In this case, the process of cutting the outer lead 2 to a predetermined length is a process of cutting by butting an opposite pair of edges of on cutters 5a and 5b with each other at the middle of the thickness of the outer lead 2 By doing this the cut face of the outer lead can be covered definitely with a slump of a solder layer, and it can be possible to make an electric and mechanical soldering junction reliably between a pattern on a substrate and a lead of a semiconductor device.</p> |
