| 发明名称 |
Two-layer solderable gold for thick film circuits |
| 摘要 |
A system of two thick film pastes containing gold, in which the first paste is deposited directly onto a substrate, and the second is deposited directly onto the first, contain Cr2O3 and Bi2O3, which enhance the adhesion to the substrate of the first deposited paste and the solderability of the second deposited paste.
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| 申请公布号 |
US5678168(A) |
申请公布日期 |
1997.10.14 |
| 申请号 |
US19950555956 |
申请日期 |
1995.11.13 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
BROWN, ORVILLE W.;NABATIAN, DAVID J. |
| 分类号 |
H01L23/498;H05K1/09;H05K3/24;(IPC1-7):B22F3/00 |
主分类号 |
H01L23/498 |
| 代理机构 |
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