| 摘要 |
The present invention relates to a semiconductor package having lead pins of lead frame for outwardly extending terminals of electrodes of a semiconductor chip embedded in a mold resin. The semiconductor package according to the present invention comprises flat lead fins connected to respective sides of a bed portion of a lead frame, an insulation film for covering at least one side of each of the lead fins, and lead pins formed on a surface of the insulation film, the lead pins being disposed at a predetermined pitch. |
