EPOXY RESIN COMPOSITION TABLET

摘要

PROBLEM TO BE SOLVED: To provide epoxy resin composition tablet excellent in moldability and reliability wherein a cavity is hardly generated in the inside or outside of a resin seal type semiconductor device. SOLUTION: This epoxy resin composition tablet has at least 90% packing ratio and is obtained by molding an epoxy resin composition powder. The tablet is that in which the maximum particle size of the powder is at most 2mm. The tablet comprises the epoxy resin composition containing a biphenyl type epoxy resin.