| 摘要 |
PROBLEM TO BE SOLVED: To eliminate troubles such as distortion due to a reaction between a conductor material and a solder material when connecting metal parts such as I/O pins, heat sink, etc., to a surface metalized portion comprising conductor materials with a low melting point such as Ag-based, Ag-Pd-based, Au-based, Cu-based materials. SOLUTION: On a ceramic wiring substrate 1 having at least one kind of a surface metalized portion 4 selected from Ag-based, Ag-Pd-based, Au-based, Cu-based, metal members 2 and 5 are connected to the surface metalized portion 4 by using an Al alloy-based solder material 3. The Al alloy-based solder material is an alloy consisting of at least one metal selected from Al, Si, Cu, Ge, Sn, Zn and Bi. |
