发明名称 |
Semiconductor package having semiconductor chip mounted on board in face-down relation |
摘要 |
The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.
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申请公布号 |
US5677575(A) |
申请公布日期 |
1997.10.14 |
申请号 |
US19960655374 |
申请日期 |
1996.05.30 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MAETA, HIDEAKI;IWASAKI, HIROSHI |
分类号 |
H01L21/56;H01L23/498;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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