发明名称 Semiconductor package having semiconductor chip mounted on board in face-down relation
摘要 The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.
申请公布号 US5677575(A) 申请公布日期 1997.10.14
申请号 US19960655374 申请日期 1996.05.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MAETA, HIDEAKI;IWASAKI, HIROSHI
分类号 H01L21/56;H01L23/498;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L21/56
代理机构 代理人
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