发明名称 SOLID STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a solid state image pickup device having a high performance which can reduce a step difference by electrodes and can minimize it. SOLUTION: This device is provided with a channel layer 4 formed in a belt shape at a surface part in a semiconductor substrate 1, a photodiode part 16 formed in the substrate 1 and adjoining the channel layer 4, an insulating film 2 formed on the substrate 1, first electrodes 13 and 15 so formed on the insulating film 2 as being insulated from each other at the rectangular direction of the channel layer 4 and as adjoining each other and a wiring layer which junctions the diode part 16 with the electrodes 12∼15. Parts of the electrodes 12∼15 on the photodiode part 16 are eliminated. In this case the first electrodes 13 and 15 and the second ones 12 and 14 on the channel layer 4 are so comprised as being duplicated in a part and upper surfaces of the electrodes 13 and 15 and ones of the electrodes 12 and 14 being made to be a common plane and a part of the first electrodes 13 and 15 of the wiring layer and a part of the second electrodes 12 and 14 are so comprised as being perfectly duplicated.
申请公布号 JPH09270505(A) 申请公布日期 1997.10.14
申请号 JP19960078852 申请日期 1996.04.01
申请人 TOSHIBA CORP 发明人 SHIBATA HIDENORI
分类号 H01L27/148;H04N5/335;H04N5/341;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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