| 摘要 |
<p>PROBLEM TO BE SOLVED: To remove flowing materials by suction so as to prevent foreign objects from adhering around the edge of a substrate and being left even after cleaning by a method wherein a suction opening is provided around the contacting part of a substrate holding member with the side of the substrate. SOLUTION: A vacuum pump connected to an exhaust vent and a drainage opening is actuated to reduce a cleaning tank in pressure, and then nitrogen gas is introduced into the cleaning tank through a nozzle 6. Ultra-pure water loaded with 2 to 10ppm of ozone is made to drop down on the surface of a wafer 3 through a chemical nozzle 2 keeping the wafer 3 rotating at a speed of 1500 to 3000rpm. In succession, mixed liquid composed of ammonium hydroxide, hydrogen peroxide aqueous solution, and ultra-pure water mixed at the ratio 2:1:5 and another mixed liquid composed of hydrofluoric acid and ultra- pure water mixed at the ratio 0.01:1 are successively made to drop down on the surface of the wafer 3, and lastly mixed liquid composed of isopropyl alcohol and ultra-pure water mixed at the ratio 1:5 is made to drop down. Then, the mixed liquid is stopped, and nitrogen gas is blown against the surface of the wafer 3 to dry it out.</p> |
