| 摘要 |
PROBLEM TO BE SOLVED: To provide a low temperature sintered circuit board capable of suppressing the warpage of the board effectively, of mounting electronic components, etc., efficiently with high reliability, and mountable on a printed wiring board firmly and stably. SOLUTION: This is a low-temperature sintered circuit board obtained by arranging internal Ag wirings 2 in a laminated circuit board 1 wherein a plurality of insulating layers made out of glass/ceramic material are laminated, arranging surface-layer wirings 4 on the front and the rear, mounting a specified electronic component 6 on the surface-layer wirings 4, and forming terminal electrodes 5 in the laminated circuit board 1. And the crossing part between the rear and the end surface of the laminated circuit board 1 is made surface C or surface R, and the terminal electrodes 5 are formed so as to be connected to the surface-layer wirings 4 on the rear, without stretching out to the front of the laminated circuit board 1. |
