发明名称 Airbridge wiring structure for MMIC
摘要 An airbridge wiring structure includes a substrate having a surface; a first wiring layer disposed on the surface of the substrate; and a second wiring layer disposed partially on the surface of the substrate and including an airbridge wiring layer crossing the first wiring layer, the first and second wiring layers being electrically insulated from each other and separated by an air gap wherein the airbridge wiring layer includes at least one longitudinal groove.
申请公布号 US5677574(A) 申请公布日期 1997.10.14
申请号 US19960629535 申请日期 1996.04.09
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 HISAKA, TAKAYUKI
分类号 H01L23/522;H01L21/768;H01L21/822;H01L23/482;H01L23/538;H01L27/04;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/522
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