| 摘要 |
PROBLEM TO BE SOLVED: To make a semiconductor module thinner by arranging a lens supporting member so that the lower surface of a lens becomes lower than the upper surface of a base plate to evade the limit of the height of the semiconductor module due to the height of the lens and to lower the height of the module. SOLUTION: A lens 26 is not mounted on a base plate 24 but is fixed on the lower surface of the upper stage part 27U of a lens supporting member 27 and the lens supporting member 27 is fixed to the base plate 24. Then, the base plate 24 is soldered to be fixed to the upper surface of a temp. adjusting element 23. It is made possible to arrange the lower end of the lens 26 of at a position lower than the upper surface of the base plate 24 by making a module constitution so that the lens 26 is suspended to be supported from the upper side by the lens supporting member 27 in such a way and the height from the bottom face 21B of the internal part of a module package 21 to the upper end of the lens 26 can be lowered. Moreover, since the lower end of the lens 26 is arranged without contact with the bottom face 21B of the internal part, heat is never conducted to the lens 26 directly. |
