| 摘要 |
PROBLEM TO BE SOLVED: To easily remove air even in such a case that the viscosity of a resin soln. is relatively large, in a mold for dip molding having a recessed part, by providing the communication hole of the surface of the mold for communicating the region above the recessed part with that of the recessed part. SOLUTION: When a mold 1 is dipped in a resin son. 9, the resin soln. 9' is bonded to the surface of the mold. At this time, if there is no communication hole 7, air is accumulated in a recessed part 6 to be not extracted therefrom and, therefore, the resin soln. is not bonded to the recessed part and a hole is formed to a molded product obtained in the above process at the part corresponding to the recessed part. By providing the communication hole 7, since air in the recessed part 6 is naturally discharged from the communication hole 7, the resin soln. 9' is uniformly bonded even to the surface of the recessed part of the mold. Subsequently, the mold having the resin soln. bonded to the surface thereof is draw up from the resin soln. to be subjected to heat treatment before being cooled. Cooling is usually performed by cooling the mold by air or immersing the same in cooling water. |
