SEMICONDUCTOR ELEMENT AND LINEAR LIGHT SOURCE USING IT

摘要

PROBLEM TO BE SOLVED: To enable the high-density wire bonding to cope with the high-density layout of elements by forming wire bonding pads having a first layer composed of extensions of lead electrodes and second layer having specified multiples of the thickness of the first layer. SOLUTION: A light emitting diode array 3 has wire bonding pads 36, each composed of a first layer 36a composed of extensions of lead electrodes 34 and second layer 36b 1.5-5 times as thick as the thickness of the first layer. Owing to this, if a high shock is applied at bonding such as second bonding of the ball bonding, it can be effectively absorbed by the second layer 36b to suppress the damage from being caused to an insulation layer 33 or semiconductor layer 31 located it and prevent the short-circuit trouble due to the breaking of the insulation layer 33. Thus it is possible to keep the quality of the element good.