发明名称 Thin IC card
摘要 A thin IC card includes a circuit board on which functional parts are mounted and a through-hole defining an edge of a battery lodging section in which a battery is disposed, the circuit board being embedded in a molding-resin section with the reverse surface of the board exposed. The battery lodging section is aligned with the through-hole of the circuit board. Electrical connections between the circuit board and the battery are effected in a recess or cutouts in the circuit board. The battery is embedded in the lodging section using an expandable resin to make the card surface flat.
申请公布号 US5677568(A) 申请公布日期 1997.10.14
申请号 US19920994957 申请日期 1992.12.22
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OCHI, KATSUNORI;TAKEMURA, SEIJI;KODAI, SYOJIRO;KURISU, TUGUO
分类号 B42D15/10;G06K19/07;G06K19/077;H01L23/28;H01M2/10;H05K1/18;H05K3/28;(IPC1-7):H01L23/02;H01L23/22 主分类号 B42D15/10
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