发明名称 |
Thin IC card |
摘要 |
A thin IC card includes a circuit board on which functional parts are mounted and a through-hole defining an edge of a battery lodging section in which a battery is disposed, the circuit board being embedded in a molding-resin section with the reverse surface of the board exposed. The battery lodging section is aligned with the through-hole of the circuit board. Electrical connections between the circuit board and the battery are effected in a recess or cutouts in the circuit board. The battery is embedded in the lodging section using an expandable resin to make the card surface flat.
|
申请公布号 |
US5677568(A) |
申请公布日期 |
1997.10.14 |
申请号 |
US19920994957 |
申请日期 |
1992.12.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OCHI, KATSUNORI;TAKEMURA, SEIJI;KODAI, SYOJIRO;KURISU, TUGUO |
分类号 |
B42D15/10;G06K19/07;G06K19/077;H01L23/28;H01M2/10;H05K1/18;H05K3/28;(IPC1-7):H01L23/02;H01L23/22 |
主分类号 |
B42D15/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|