发明名称 |
Apparatus for multilayer conductor chip packaging |
摘要 |
Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
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申请公布号 |
US5675884(A) |
申请公布日期 |
1997.10.14 |
申请号 |
US19950487465 |
申请日期 |
1995.06.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HORTON, RAYMOND ROBERT;LANZETTA, ALPHONSO PHILIP;NOYAN, ISMAIL CEVDET;PALMER, MICHAEL JON |
分类号 |
H01L23/50;H01L21/48;H05K3/34;H05K13/00;(IPC1-7):B23Q39/02;B21F1/00 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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