| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to continuously execute semiconductor sealing for a long time by injection molding by using can epoxy resin sealing material. SOLUTION: The method for manufacturing a semiconductor device comprises the steps of fixedly inserting the lead frame connected with a semiconductor element or wire bonded with it or the lead connected with the element into an injection mold, injection charging epoxy resin sealing material to the mold by an injection molding machine, and curing it. In this case, the heating cylinder of the machine is divided into a plurality of zones, the respective zones are independently temperature controlled, the most nozzle side zone is controlled to 65 to 110 deg.C and the most hopper side zone is controlled down to the ambient temperature to 50 deg.C. |
