发明名称 MULTILAYER PRINTED-WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To prevent the generation of a malfunction of an electronic circuit and to prevent a breaking of an electronic component, which is arranged in the vicinity of a land for positioning use, from being generated by a method wherein the land for positioning use is connected with a circuit for internal layer. SOLUTION: A multilayer printed-wiring board 1 is used centering around an internal layer wiring board 5 with circuits 3 and 4 for internal layer use, which are respectively provided on both surfaces of an insulating board 2. External layer wiring boards 8 and 9 are respectively stacked on both surfaces of the board 5 via bonding agents 6 and 7. A land 10 for electronic component mounting use, a land 11 for positioning use, planted resist layers 12 and the like are provided on the board 8. A hole 13 for through hole is provided in the land 11 in such a way as to pass through the center of the land 11. A plating 14 for through hole, which is connected with the circuit 3, is provided in the hole 13. As the land 11 is connected with the circuit 3 through the through hole plating 14, a charge is prevented from being stored in the land 11. Thereby, a malfunction of an electronic circuit, a breaking of an electronic component, a mistake of detection of the land or the like can be prevented from being generated.</p>
申请公布号 JPH09270583(A) 申请公布日期 1997.10.14
申请号 JP19960103841 申请日期 1996.03.29
申请人 HITACHI AIC INC 发明人 MIZUI SHIGENOBU
分类号 H05K1/02;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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