An epoxy resin composition which exhibits a low dielectric constant and a low dielectric dissipation factor as well as an excellent working susceptibility after its curing is provided. The epoxy resin composition contains at least one member selected from a novolak resin (A) prepared by condensing formalin and an alkylphenol compound; and an epoxy resin (B) prepared by glycidylating said novolak resin (A) with an epihalohydrin.
