发明名称 Simultaneous injection molding and patterning apparatus
摘要 A heating device used for a simultaneous injection molding and patterning method such that: a decorative pattern sheet is disposed between a pair of mutually opposed molds (mold A formed with a vent and mold B formed with an injection gate); the decorative pattern sheet is heated and softened by the heating device; the decorative pattern sheet is brought into tight contact with a cavity surface of mold A on the basis of a pressure difference caused by exhaustion of mold A through the vent; and a molten resin is injected into the molds through the injection gate to mold a product patterned on the basis of the decorative pattern sheet. The heating device includes: a heating body for supplying heat to the decorative pattern sheet; and heating body moving members for moving the heating body between a heating position at which the heating body is confronted with the decorative pattern sheet to heat and soften the decorative pattern sheet and a non-heating position at which the heating body is moved away from a space between a pair of the molds. The heating position of a heating surface of the heating body is not parallel to the non-heating position of the heating surface of the heating body. Since the positional relationship of the heating surface of the heating body is non-parallel at the heating positions, it is possible to markedly reduce the installation space of the apparatus.
申请公布号 US5676981(A) 申请公布日期 1997.10.14
申请号 US19950492143 申请日期 1995.06.19
申请人 DAI NIPPON PRINTING CO., LTD. 发明人 MIYAZAWA, KAZUSHI;HANAMOTO, KEIJI;ATAKE, HIROYUKI
分类号 B29C45/14;B29C45/72;(IPC1-7):B29C45/14 主分类号 B29C45/14
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