STANDARDIZED BONDING LOCATION PROCESS AND APPARATUS

摘要

A process for making a semiconductor device and the resulting device having standardized die-to-substrate bonding locations are herein disclosed. The semiconductor die (32) provides a standard ball grid or other array of a particular size, pitch and pattern such that as the size, configuration or bond pad arrangement of the die changes, a standard substrate (60) (the term including leadrames) having a similarly standardized array of terminals (62, 64) or trace ends can be employed to form a semiconductor device (30). It is also contemplated that dies having markedly different circuitry but a common array pattern may be employed with the same substrate or other carrier.