| 摘要 |
<p>The invention pertains to a process for the hybrid integration of at least one opto-electronic component (9) and a waveguide (14) provided on a substrate (13), in which process one or more opto-electronic components are provided on a connector piece (6) and the connector piece (6) is placed on the substrate (13) and moved up to the edge of the waveguide (14), with the shape of the connector piece (6) being wholly or largely complementary, and the connector piece (6) when it abuts against the edge of the waveguide (14) having only one degree of freedom in the plane of the substrate (13). The process provides an easy way of producing integrated electro-optical devices.</p> |
