| 摘要 |
A multi-layered printed wiring board for high frequency application includes a first board of polytetrafluoroethylene (PTFE) having a metallic sheet on each side. The first side is etched to form high frequency circuity using micro-strip technology and the second side being a metallic sheet forming the ground plane. Laminated to the ground plane of the first board is a fiberglass board of thickness, A. Further, laminated to the fiberglass board is a second board of fiberglass having a thickness, A. The second board also has metallic sheets on both side, the side being laminated to the fiberglass board being etched to form strips, prior to being laminated, forming signal and transmission lines utilizing strip-line technology. Vias are formed to interconnect predetermined metallic layers. |
