发明名称 HANDOTAISOSHIBONDEINGUYOKINGOKINSAISEN
摘要 PURPOSE:To obtain a fine gold alloy wire which ha a high tensile strength at a normal and high temperature and shows no embrittlement caused by recrystallization creating large crystal grains at the time of bonding and has a high softening point and a high junction strength by a method wherein the material of the fine wire contains a specific content of Li and remnants of Au and unavoidable impurities and so forth. CONSTITUTION:The material of a fine gold alloy wire contains 0.2-50 wt.ppm of Li and remnants of Au and unavoidable impurities. Or the material contains 0.5-50 wt.ppm, 1-50 wt.ppm of at least one element selected from an element group composed of La, Be, Ca, Si, Ag, Ge, Ce, Pr, In, Pb, Ti, Zr and Pd and remnants of Au and unavoidable impurities. Au and Li are contained in order to improve a tensile strength under a normal and high temperature. The above mentioned specific elements are contained in order to improve a tensile strength under a normal and high temperature compared with the tensile strength obtained when Li only is contained and, at the same time, improve a softening point, suppress creation of large crystal grains at the time of bonding and avoid resin flow in a long loop and the like.
申请公布号 JP2661247(B2) 申请公布日期 1997.10.08
申请号 JP19890070063 申请日期 1989.03.22
申请人 MITSUBISHI MATERIARU KK 发明人 MORI TAMOTSU;TANAKA MASAYUKI
分类号 H01L21/60 主分类号 H01L21/60
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