发明名称 |
Polishing slurry |
摘要 |
A polishing slurry for use in chemical mechanical polishing is disclosed. The polishing slurry contains a solvent and polishing particles dispersed in this solvent. The polishing particles are selected from silicon nitride, silicon carbide, and graphite. The primary particle size of the polishing particles dispersed in the solvent is appropriately 0.01 to 1000 nm. When the polishing particles are colloidally dispersed in the solvent, the secondary particle size of the polishing particles is appropriately 60 to 300 nm. |
申请公布号 |
EP0773269(A3) |
申请公布日期 |
1997.10.08 |
申请号 |
EP19960118201 |
申请日期 |
1996.11.13 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MIYASHITA, NAOTO;ABE, MASAHIRO;SHIMOMURA, MARIKO |
分类号 |
B24B37/00;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;H01L21/32 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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