| 摘要 |
It is an object of the invention to provide a thinned semiconductor laser module. The semiconductor laser module is provided with a module package, an inverted L-shaped lens supporting member, composed of a horizontal upper part and a vertical under part, where a corner thereof defines a boundary therebetween, a substrate fixed to an under surface of the vertical under part of the lens supporting member, a temperature regulation element, the under surface of which is fixed on an interior bottom surface of the module package and the upper surface of which is fixed to the under surface of a substrate, a semiconductor laser for emitting a laser beam, being fixed to a portion near a side-end of a substrate, an optical fiber, an end of which is fixed on a point irradiated by the laser beam on a side wall of the module package, and a lens, which is fixed on the under surface of the horizontal upper part of the lens supporting member, for optically coupling the semiconductor laser with the optical fiber, and the lowest end of the lens is set lower than the upper surface of the substrate. <IMAGE> |
