| 摘要 |
<p>PURPOSE:To obtain a card having no difference in rigidity between an IC chip arrangement part and the other parts and hardly generating the convergence of bending stress, by using a metal substrate having the same size as a card size. CONSTITUTION:An IC module 1 connects an IC chip 2 to a metal substrate 5 having a core of a low-magnetizable metal, and the connection part and the IC chip 2 are sealed and protected with a sealing resin 3. On the surface of the metal substrate 5 on the reverse side to the IC chip 2 mounted, an external input terminal electrically connected by a through hole is formed. This metal substrate 5 is made to have approximately the same shape as a card shape and laminated to a card substrate 4 of a low-magnetizable metal through an adhesive 10 to be a high-rigidity laminated body; in this structure, the covergence of bending stress on the arrangement part of the IC chip 2 is prevented, and a resistance to bending can be obtained.</p> |
