| 摘要 |
PURPOSE:To make it possible to perform processing characterized by high throughputs, by providing a conveying mechanism comprising a conveying part which conveys bodies under processing into a heat treating mechanism and a standby part which temporarily holds the bodies under processing. CONSTITUTION:Four juxtaposed hot plates 110, 111, 112 and 113 are provided in a heat-treating mechanism 115 and a semiconductor wafer 114 is heat-treated there. A conveying mechanism 118 comprising a conveying part 116 and a standby part 117 is provided in the vicinity of the heat treating mechanism 115. The conveying part 116 can be moved in the lateral direction X in parallel with the mechanism 115 and sucks and holds the semiconductor wafer 114. The standby part 117 has a mounting stage for temporarily holding the semiconductor wafer 114. Both the number of the hot plates (n) and an allowance time 122Tw are set and controlled with respect to a cycle time T. Thus said cycle time can be synchronized with the cycle times of processing mechanisms other than the heat-treating mechanism. The decrease in throughputs of the apparatus can be prevented by the heat-treating time of the heat-treating mechanism. |
