| 摘要 |
PROBLEM TO BE SOLVED: To obtain a low-cost adhesive epoxy resin compsn. for sealing excellent in resistance to moisture permeation, etc., by dispersing a specified amt. of a carbon powder having a specified average particle size as the filler in an epoxy resin contg. a curative. SOLUTION: This compsn. is prepd. by mixing an epoxy resin (e.g. a phenol novolak epoxy resin) with a curative (e.g. diaminodiphenylmethane) and 2-5wt.% carbon powder having an average particle size of 3μm or lower. Only by replacing a conventionally used silica filler with a small amt. of a low-cost carbon powder, high resistance to moisture permeation is obtd. even when the sealing width is as narrow as 1mm or lower, enabling high reliability of sealing to be achieved. When a fine silica powder in an amt. of 2wt.% or lower is dispersed together with the carbon powder, the compsn. having suitable thixotropic properties and improved applicability can be obtd.
|
