| 摘要 |
An improved apparatus for cleansing a semiconductor wafer which is capable of reducing the cleansing space by providing an inner tub made of a shape memory alloy and deforming the shape of the inner tub into the shape of the wafer, for thus reducing the cleansing space. The apparatus includes an outer tub having a supply tube for supplying a cleansing liquid and a discharge tube for discharging the cleansing liquid, an inner tub including an upper portion made of a shape memory alloy and disposed within the outer tub, a temperature control member for controlling the temperature of the cleansing liquid, a baffle plate for controlling the flowing amount of the cleansing liquid supplied to a wafer through the supply tube, a pump disposed in the supply tube for supplying the cleansing liquid into the inner tub, and a filter for filtering the cleansing liquid.
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