发明名称 Apparatus and method for polishing workpiece
摘要 A polishing apparatus has a circular abrasive cloth on a turntable, and a top ring for holding a workpiece and pressing the workpiece against the circular abrasive cloth to polish the workpiece while the circular abrasive cloth is rotated about a center axis and the workpiece is rotated by the top ring about a top ring axis located at a positioned spaced from the center axis. The position is spaced from the center axis by a distance rc, and the workpiece has a radius rw. When the workpiece is not angularly moved with respect to the circular abrasive cloth wile the workpiece is being polished, a ratio Rc=rc/rw is in a range from 1.10 to 2.60. When the workpiece is angularly moved at a radius rs through an angular displacement +526 (degrees) in arcuate reciprocating motions with respect to the circular abrasive cloth, a ratio Rs=rs/rw, the angular displacement +526 , and the ratio Rc are selected to be of a certain relationship.
申请公布号 US5674109(A) 申请公布日期 1997.10.07
申请号 US19950527421 申请日期 1995.09.13
申请人 EBARA CORPORATION 发明人 KANZAWA, MORIHITO;KIMURA, NORIO
分类号 B24B37/04;(IPC1-7):B24B1/00 主分类号 B24B37/04
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