发明名称 APPARATUS AND METHOD FOR FABRICATING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To perform a stand-by processing for a next lot wafer easily with a simplified construction irrespective of an exposure operation parameter of the next lot, by forcing a wafer of the next lot to stand ready at an arbitrary standby position instructed by a user when an exposure processing is applied to a wafer of a present lot. SOLUTION: A wafer 3 after it is exposed to light on a wafer stage 2 is carried out by an arm 13 of a longitudinal slider 8, is then delivered to an arm 10 of a lateral slider 7, and is accommodated in a carrier 6. Herein, an inline delivery unit 14 is provided on one end of the lateral slider 7. The wafer 3 before the exposure and the wafer 3 after the exposure are delivered by the inline delivery unit 14 between the unit 14 and an inline apparatus 15 in which a coater and a developer are accommodated. Hereby, even if the wafer lot is exchanged manually, the exposure processing to the wafer 3 of the next lot is achieved after the exposure processing to the wafer 3 of the present lot is completed.
申请公布号 JPH09266146(A) 申请公布日期 1997.10.07
申请号 JP19960099326 申请日期 1996.03.28
申请人 NIKON CORP 发明人 FUJIMA TOSHIHISA
分类号 H01L21/027;G03F7/20;(IPC1-7):H01L21/027 主分类号 H01L21/027
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