| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a grooved backing pad suitable for grinding a semi-conductor wafer by a waxless method. SOLUTION: A manufacturing device of a backing pad is provided with a load/unload conveyor 11 and a groove forming device 21 above a chuck table 4. In a body 22 of the groove forming device, a plurality of aluminum circular flange parts 27 are provided on an aluminum hollow shaft 26. A plurality of circular flange parts are uniform in diameter, concentric with the hollow shaft, and fixed with appropriate intervals in the axial direction of the hollow shaft. In manufacturing the grooved backing pad, a work to which a sheet-like elastic member is fixed is sucked to the chuck table 4 by the load/unload conveyor 11, and then, steam is fed to the hollow shaft 26, the circular flange parts 27 are heated to the temperature above the softening point of the sheet-like elastic member, and the circular flange parts are pressed against the surface of the sheet-like elastic member and rolled thereon by traveling the body 22 of the groove forming device along the surface of the sheet-like elastic member while it is rotated. |
