| 摘要 |
PROBLEM TO BE SOLVED: To obviate the need for manual regulation of height between a series of manufacturing processes for circuit board panels or base boards, having different thicknesses by a method wherein a compressive spring is arranged so that the circuit board panel having the arbitrary thickness of a plurality of different given thicknesses is contained between the plate and a rail. SOLUTION: A leveling device 136 contains circuit board panels 105 having different thicknesses and employs spring devices 218 and 219 to regulate to ensure flatness of the circuit board panel 105. When the circuit board panel 105 supported by the first surface 204 of a plate 200 is positioned at a rail, a spring is compressed in such a manner to contain the different thicknesses of the circuit board panels 105. Though a given spring force is enough high to hold the containing most thin circuit board panel 105, the spring force is not too high to break the containing most thick circuit board panel 105. |
