| 摘要 |
PROBLEM TO BE SOLVED: To easily and surely remove an unnecessary resist on an article by making the adhesive strength of an adhesive layer to the resist higher than that of the resist to the article and specifying the modulus of elasticity of the adhesive layer. SOLUTION: When an adhesive layer is formed on an article such as a wafer on which a resist exists and the resist is removed by peeling the adhesive layer, together with the resist, from the article, the adhesive strength of the adhesive layer to the resist is made higher than that of the resist to the article and the modulus of elasticity of the adhesive layer is regulated to >=1kg/mm<2> at the time of peeling. The pref. 180 deg. peeling and adhesive strength between the adhesive layer and the resist is >=5g/10mm, especially 5-5,000g/10mm, more especially about 100-4,000g/10mm. |
