发明名称 Method of manufacturing a semiconductor device
摘要 Disclosed herein is a semiconductor device comprising a semiconductor substrate, a well region provided in the surface of the substrate, a plurality of MOSFETs provided in the well region. The well region has parts having a low surface impurity concentration. Some of the MOSFETs have their channel regions provided in those parts of the well region which have the low surface impurity concentration. The other MOSFETs have their channel regions provided in other parts of the well region.
申请公布号 US5674763(A) 申请公布日期 1997.10.07
申请号 US19950428827 申请日期 1995.04.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SUGIURA, SOUICHI;KOYANAGI, MASARU
分类号 H01L27/088;H01L21/8234;H01L21/8238;H01L27/092;H01L27/108;(IPC1-7):H01L21/265 主分类号 H01L27/088
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