Process and device for processing plate-like workpieces

摘要

PCT No. PCT/DE94/00412 Sec. 371 Date Dec. 15, 1995 Sec. 102(e) Date Dec. 15, 1995 PCT Filed Feb. 10, 1994 PCT Pub. No. WO95/22084 PCT Pub. Date Aug. 17, 1995The proposal is for a process and device for machining plate-like workpieces, especially silicon wafers or glass masks by coating the surface with a liquid, making use of capillary forces to distribute the liquid over the surface. To this end, a narrow slit is formed in which capillary forces act on the liquid. Features of the process are low liquid consumption and insensitivity to soiling.