| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sucking device with which the deflection by the own weight of the material to be sucked can be corrected when a wafer, having a wide area against the thickness, is attracted by a chuck main body. SOLUTION: This chuck device is provided on a chuck main body 1A facing to a wafer 2, the chuck device is also provided with a receiving part 4A having a sucking surface 5A which comes in contact with the wafer 2, and the wafer 2 is sucked by the sucking surface 5A. In this case, a recessed part 11A, having the bottom face 1Ac where the chuck main body 1A does not come into contact with the wafer 2 when the wafer 2 is sucked, and fluid introducing devices 6A and 7A, with which fluid is introduced into the recessed part, are provided. The deflection caused by the own weight of the wafer 2. to the side of the bottom face of the recessed part is corrected by the fluid 12A introduced into the recessed part.</p> |
