| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device with which a resin sealing operation can be conducted easily by using the epoxy resin sealing material which is excellent in dump-proof reliability and solid in normal temperature. SOLUTION: The electrode part of a semiconductor element 5 is mounted on the wiring electrode of a substrate 2 through a conductive bonding material 4. Then, a sealing resin composition, which is solid in normal temperature as shown in the below mentioned (A), is placed on the placing surface of the semiconductor element 2 of a substrate 2, and by fusing it by heating, it is filled in the void provided between the substrate 2 and the semiconductor element 5, and a sealing resin layer 6 is formed in the void between the substrate 2 and the semiconductor element 5. (A), (a) crystalline epoxy resin of two functional epoxy resin which is solid in normal temperature, (b) novolac type phenol resin, (c) silica powder of maximum grain diameter of 30μm or smaller, (x) pellet density 99% or more against true density, (y) square pole-like pellet of cross sectional area 1mm×2mm is fused by heating at 150 deg.C for 10 minutes, and the intrusion distance, when the fused pellet is intruded between two mirror face glass plates having 50μm gap, is set at 15mm or more.
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