发明名称 RADIATION-CURABLE COMPOSITION AND PRODUCTION OF CURED PRODUCT PATTERN USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a radiation-curable composition containing a specific poly mer molecule and an acidic substance, small in weight change or shrinkage involved in its curing, excellent in preservability, and suitable for e.g. the electri cal insulation films for semiconductor devices. SOLUTION: This curable composition comprises (A) 0.01-20wt.% of a base- generating substance which generates a base when irradiated with radiation (e.g. a benzyl carbamate compound), (B) a polymer molecule containing Si-H bonds capable of forming Si-O bonds and hydrogen molecules when reacted with hydroxyl groups by the action of the above base and expressed by the formula (R is H, a 1-8C hydrocarbon, etc.; (a) and (b) are each 0-1; (a+b)=1) and (C) <=90mol%, based on the component A, of an acidic substance such as a carboxylic acid, phenolic compound, phosphoric acid compound or acid anhydride, and furthermore, pref. (D) a hydroxyl-bearing cross-linking agent such as a silane compound bearing two or more silanol groups on average.
申请公布号 JPH09263638(A) 申请公布日期 1997.10.07
申请号 JP19960077043 申请日期 1996.03.29
申请人 DOW CORNING ASIA LTD 发明人 TAKEUCHI KASUMI;BURAIAN ROBAATO HAAKUNESU;TACHIKAWA MAMORU
分类号 C08L83/05;C08G77/06;C08G77/12;C08G77/16;C08G77/22;C08K5/00;C08L83/04;G03F7/004;G03F7/075;(IPC1-7):C08G77/12 主分类号 C08L83/05
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