发明名称 INDIUM-CONTAINING COPPER-LEAD ALLOY BEARING AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To obtain a copper-lead alloy bearing excellent in loading resistance and capable of withstanding long use by forming a lead-tin overlay layer interposed between overlay layers composed of In on a copper-lead alloy bearing layer formed on a backing steel plate by adhesion. SOLUTION: An alloy bearing layer 2 is formed as usual on the surface of a backing steel plate 1 by adhesion. The layer 2 is composed of copper-lead alloy and has a structure in which lead grain phases are dispersed in a matrix and can be constituted as sintered alloy and cast alloy. Subsequently, a lower overlay layer 3 composed essentially of In is formed as plating layer on the surface of the layer 2, without interposing an Ni plating layer, etc., and then, a lead-tin overlay layer 4 is continuously formed as plating layer on the surface of the layer 3. After that, an upper overlay layer 5 composed essentially of In is formed as plating layer on the surface of the layer 4 and then heat treatment is carried out at 150±5 deg.C to allow the tin, In, etc., in the layers 3, 4, 5 to diffuse and enter into solid solution in the lead phases in the layer 2, by which the copper-lead alloy bearing 10 can be obtained.
申请公布号 JPH09263863(A) 申请公布日期 1997.10.07
申请号 JP19960094806 申请日期 1996.03.25
申请人 NDC CO LTD 发明人 KOYANAGI MASAYUKI
分类号 F16C33/12;C22C9/08;C25D7/10;(IPC1-7):C22C9/08 主分类号 F16C33/12
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