| 发明名称 |
Low molecular weight liquid injection molding resins having a high vinyl content |
| 摘要 |
Low molecular weight, high alkenyl content silicone resins of the general formula MyMvizDaDvibTcTvidQ or MyMvizDaDvibTcTvid are disclosed, their use in curable liquid injection molding compositions, a process for varying the cure properties of such compositions and articles of manufacture made thereby and therewith.
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| 申请公布号 |
US5674966(A) |
申请公布日期 |
1997.10.07 |
| 申请号 |
US19960631302 |
申请日期 |
1996.04.09 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
MCDERMOTT, PHILIP J.;JOHNSON, DONALD S.;WARD, BRIAN J.;JERAM, EDWARD MATTHEW |
| 分类号 |
B29C45/00;B29K83/00;C08G77/20;C08G77/22;C08L83/04;C08L83/07;(IPC1-7):C08G77/20 |
主分类号 |
B29C45/00 |
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